Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations – Complex Spring Forms
| Place of Origin | Shenzhen, China |
|---|---|
| Brand Name | TF |
| Certification | lSO9001 |
| Model Number | TF-001 |
| Minimum Order Quantity | 1 |
| Price | 0.07-0.23USD |
| Packaging Details | Carton packaging 18*15*12cm (packaging can be customized according to customer product requirements) |
| Delivery Time | 3days/Start |
| Payment Terms | T/T |
| Supply Ability | 10000000pieces/per month |
| Product Type | Custom Antenna Grounding Fingers / Complex Form RF Module Shielding Springs / Massive MIMO Contacts | Main Material | Beryllium Copper C17200 / Beryllium Copper C17510 / Tin-Plated Steel |
|---|---|---|---|
| Material Thickness | 0.08-0.12mm / 0.12-0.18mm / 0.18-0.25mm | Process Type | Precision Progressive Die Stamping / Complex Spring Arm Forming / Stress Relief Heat Treatment / Non-Standard Customization |
| Surface Finish | Tin Plating / Gold Plating / Nickel Plating | Shielding Effectiveness | 60-90dB / 90dB+ |
| Compression Range | 0.5-2.0mm / 2.0-4.0mm | Operating Frequency | ≤6GHz / ≤28GHz / ≤39GHz |
| Highlight | Custom Stamped Grounding Fingers,5G Base Station Grounding Fingers,Complex Spring Precision Stamping Parts |
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Tingfeng Hardware provides custom grounding fingers for 5G Massive MIMO antennas, specializing in complex spring forms. Manufactured from BeCu C17200 with 60–90 dB shielding effectiveness, a 0.5–4.0 mm compression range, and stress relief heat treatment for stable contact force under outdoor thermal cycling. With 16 years of precision manufacturing experience, we help telecom equipment clients address long-term outdoor deployment reliability challenges and the consistency requirements of large-scale antenna arrays.
5G AAUs contain dozens to hundreds of densely packed RF channels, each requiring reliable low-impedance grounding to suppress inter-channel interference. Our BeCu grounding fingers feature complex spring form designs, conductivity of approximately 22% IACS, multi-contact redundancy that reduces single-point failure risk, and stress relief heat treatment that prevents stress relaxation under -40°C to +85°C outdoor cycling. On the commercial side, 5G deployment is shifting from "coverage first" to "O&M efficiency and long-term reliability first." Clients need grounding solutions that maintain performance consistency over years of outdoor service and reduce field maintenance needs. Our full-batch force testing and material traceability system respond directly to this requirement.
| Feature | Advantage to You |
|---|---|
| Complex spring form customization | Grounding finger shape customized to antenna element layout, maximizing space utilization |
| BeCu ≥22% IACS high conductivity | Low-impedance grounding for mmWave bands, reducing signal loss |
| Stress relief heat treatment | Stable contact force under -40°C to +85°C outdoor cycling, reducing stress relaxation |
| 0.5–4.0 mm wide compression | Accommodates various assembly gaps between antenna elements and RF modules |
| Full-batch force testing | Consistency assurance for large-scale arrays, reducing field O&M pressure |
| Specification Item | Detail / Range | Tolerance / Standard |
|---|---|---|
| Material Type | Beryllium Copper C17200 | Conductivity ≥22% IACS |
| Material Thickness | 0.08 mm – 0.25 mm | ±0.005 mm |
| Contact Force | 0.3 N – 2.0 N | ±15% |
| Compression Range | 0.5 mm – 4.0 mm | Design dependent |
| Shielding Effectiveness | 60 – 90 dB | Design dependent |
| Surface Finish | Tin / Gold / Nickel Plating | Thickness controlled |
| Operating Temperature | -40°C – +85°C | Outdoor Grade |
| Salt Spray Test | ≥ 96 hours | No corrosion |
AAU antenna element grounding fingers and RF channel shielding contacts.
Filter shielding springs and power amplifier grounding contacts.
28 GHz / 39 GHz antenna element grounding and phased array module shielding springs.
Base station radome grounding fingers and remote radio unit contacts.
Can you handle complex custom designs and provide design optimization suggestions?
Absolutely. This is our core expertise. We provide free DFM analysis within 3–5 days, often helping clients achieve 15–30% cost reduction through design for manufacturability.
How do you ensure quality consistency and handle defect issues?
We implement a rigorous 4-stage QC system with 100% full inspection. Our track record shows a 99.99% qualification rate.
What are your lead times and how do you handle urgent orders?
Standard lead times: 3–7 days for prototypes and 7–15 days for mass production. We offer VIP prioritization that cuts lead times by up to 30%.
Will I get timely responses and professional support throughout the project?
Yes. You get a 1-on-1 exclusive consultant with a 1-hour initial response commitment and 24-hour technical support.
Can you provide material certifications and environmental compliance reports?
Yes. We provide material certifications and environmental test reports (RoHS, REACH compliant) upon request.
How do you protect my designs and intellectual property?
We start with a mutual NDA and implement strict mold ownership protection and confidential data security measures.
What are your payment terms and MOQ requirements?
We offer flexible payment terms (T/T, L/C at sight) and MOQ from 1 piece for prototyping.

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