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Custom High-Frequency Stamped Grounding Fingers for 5G Base Stations – Complex Spring Forms
| Tempat asal | Shenzhen, Tiongkok |
|---|---|
| Nama merek | TF |
| Sertifikasi | lSO9001 |
| Nomor model | TF-001 |
| Kuantitas min Order | 1 |
| Harga | 0.07-0.23USD |
| Kemasan rincian | Kemasan karton 18*15*12cm (kemasan dapat disesuaikan sesuai kebutuhan produk pelanggan) |
| Waktu pengiriman | 3 hari/Mulai |
| Syarat-syarat pembayaran | T/T |
| Menyediakan kemampuan | 10.000.000 lembar/per bulan |
Detail produk
| Jenis Produk | Jari Pembumian Antena Khusus / Pegas Pelindung Modul RF Bentuk Kompleks / Kontak MIMO Masif | Bahan Utama | Tembaga Berilium C17200 / Tembaga Berilium C17510 / Baja Berlapis Timah |
|---|---|---|---|
| Ketebalan Bahan | 0,08-0,12mm / 0,12-0,18mm / 0,18-0,25mm | Jenis Proses | Stamping Die Progresif Presisi / Pembentukan Lengan Pegas Kompleks / Perlakuan Panas Penghilang Stre |
| Permukaan Selesai | Pelapisan Timah / Pelapisan Emas / Pelapisan Nikel | Efektivitas Perisai | 60-90dB / 90dB+ |
| Rentang Kompresi | 0,5-2,0 mm / 2,0-4,0 mm | Frekuensi Operasi | ≤6GHz / ≤28GHz / ≤39GHz |
| Menyoroti | Custom Stamped Grounding Fingers,5G Base Station Grounding Fingers,Complex Spring Precision Stamping Parts |
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Deskripsi Produk
Custom High-Frequency Stamped Grounding Fingers for 5G Base StationsTingfeng Hardware provides custom grounding fingers for 5G Massive MIMO antennas, specializing in complex spring forms. Manufactured from BeCu C17200 with 60–90 dB shielding effectiveness, a 0.5–4.0 mm compression range, and stress relief heat treatment for stable contact force under outdoor thermal cycling. With 16 years of precision manufacturing experience, we help telecom equipment clients address long
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