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Shielded Spring Contacts for High-Speed Data Connectors & Telecom Equipment – Beryllium Copper Stamping
| Place of Origin | Shenzhen, China |
|---|---|
| Brand Name | TF |
| Certification | lSO9001 |
| Model Number | TF-001 |
| Minimum Order Quantity | 1 |
| Price | 0.07-0.23USD |
| Packaging Details | Carton packaging 18*15*12cm (packaging can be customized according to customer product requirements) |
| Delivery Time | 3days/Start |
| Payment Terms | T/T |
| Supply Ability | 10000000pieces/per month |
Product Details
| Product Type | Shielded Spring Contacts / High-Speed Connector Grounding Springs / Telecom Equipment Shield Contacts | Main Material | Beryllium Copper C17200 / Beryllium Copper C17510 / Tin-Plated Steel |
|---|---|---|---|
| Material Thickness | 0.08-0.12mm / 0.12-0.18mm / 0.18-0.25mm | Process Type | Precision Progressive Die Stamping / Bending Forming / Stress Relief Heat Treatment |
| Surface Finish | Gold Plating / Tin Plating / Nickel Plating | Shielding Effectiveness | 30-60dB / 60-90dB |
| Compression Range | 0.5-1.5mm / 1.5-3.0mm | Data Rate | 10Gbps / 25Gbps / 50Gbps+ |
| Highlight | Shielded spring contacts for telecom equipment,Beryllium copper stamping contacts,High-speed data connector spring contacts |
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Product Description
Shielded Spring Contacts for High-Speed Data Connectors & Telecom Equipment
Beryllium Copper Stamping
Tingfeng Hardware provides shielded spring contacts specifically for high-speed data connectors and telecom equipment, manufactured from beryllium copper through precision stamping processes. These spring contacts are used for EMI shielding and grounding connections in high-speed backplane connectors, data center switches, and telecom equipment, ensuring high-speed signal integrity.
With 16 years of precision manufacturing experience, our products comply with ISO 9001 and RoHS standards, with custom designs supported per customer drawings.
Product Overview
Shielded spring contacts in high-speed data connectors and telecom equipment are critical components for ensuring signal integrity. As data rates increase to 25Gbps and beyond, the impact of electromagnetic interference on signal quality becomes increasingly significant.
Our beryllium copper shielded spring contacts effectively suppress electromagnetic leakage and crosstalk by providing multiple low-impedance grounding paths around connectors. Beryllium copper (conductivity approximately 22% IACS) ensures low-impedance grounding, with gold plating providing stable contact interfaces and oxidation resistance.
The spring contact design provides 0.5-3.0mm compression range, accommodating various gaps between PCBs and shielding covers. Each spring contact undergoes 100% force testing and dimensional inspection, suitable for high-speed backplane connectors, data center switches, core routers, and other telecom equipment.
Features & Advantages
| Feature | Advantage to You |
|---|---|
| Beryllium copper high-conductivity material | Conductivity ~22% IACS, ensuring low-impedance grounding paths for high-speed signals |
| Multi-point grounding design | Multiple spring contacts provide redundant grounding, reducing EMI leakage risk |
| Wide compression range | 0.5-3.0mm compression travel, accommodating various PCB-to-shield gaps |
| Gold plating surface finish | Low contact resistance and high oxidation resistance, ensuring long-term signal integrity |
| High-speed signal compatibility | Suitable for connector shielding applications at 25Gbps and above |
Product Specifications
| Specification Item | Detail / Range | Tolerance / Standard |
|---|---|---|
| Material Type | Beryllium Copper C17200 | Conductivity ≥22% IACS |
| Material Thickness | 0.08 mm -- 0.25 mm | ±0.005mm |
| Contact Force | 0.3 N -- 2.0 N | ±15% |
| Compression Range | 0.5 mm -- 3.0 mm | Design dependent |
| Surface Finish | Gold / Tin / Nickel Plating | Thickness controlled |
| Operating Temperature | -55°C -- +200°C | Beryllium copper property |
| Data Rate | 25Gbps -- 50Gbps+ | Design dependent |
| Packaging | Tape & Reel / Bulk | As required |
Product Applications
- High-Speed Backplane Connectors: Data center switch backplane shielding springs, core router connector grounding contacts, server backplane EMI shielding components
- Telecom Equipment: Base station control board shielding springs, transmission equipment connector grounding contacts, access network equipment EMI shielding components
- Test & Measurement Equipment: High-speed oscilloscope connector shielding springs, network analyzer interface grounding contacts, signal generator EMI shielding components
- Data Centers: Server I/O connector shielding springs, storage device connector grounding contacts, network switching equipment EMI shielding components
Frequently Asked Questions
Can you handle complex custom designs and provide design optimization suggestions?
Absolutely. This is our core expertise. We provide free DFM analysis within 3-5 days, often helping clients achieve 15-30% cost reduction through design for manufacturability.
How do you ensure quality consistency and handle defect issues?
We implement a rigorous 4-stage QC system with 100% full inspection. Our track record shows 99.99% qualification rate.
What are your lead times and how do you handle urgent orders?
Standard lead times: 3-7 days for prototypes, 7-15 days for mass production. We offer VIP prioritization cutting lead times by up to 30%.
Will I get timely responses and professional support throughout the project?
Yes. You get a 1v1 exclusive consultant with 1-hour initial response commitment and 24-hour technical support.
Can you provide material certifications and environmental compliance reports?
Yes. We provide material certifications and environmental test reports (RoHS, REACH compliant) upon request.
How do you protect my designs and intellectual property?
We start with mutual NDA and implement strict mold ownership protection and confidential data security measures.
What are your payment terms and MOQ requirements?
We offer flexible payment terms (T/T, L/C at sight) and MOQ from 1 piece for prototyping.
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